Title :
An Experimental Low-Cost, Low-Data-Rate Rapid Structural Assessment Network
Author :
Chin, Jren-Chit ; Rautenberg, Jeffrey M. ; Ma, Chris Y T ; Pujol, Santiago ; Yau, David K Y
Author_Institution :
Purdue Univ., West Lafayette, IN, USA
Abstract :
In this paper, we present the design, implementation, and experimental evaluation of a wireless sensor network for real-time structural ldquohealthrdquo monitoring. We use simple custom-built gages to detect cracks in critical structural elements. The main data reports require no structural analysis for interpretation, have a low data rate, and are naturally resilient to loss. We show how a variety of low-cost, off-the-shelf data acquisition/communication devices can be used to support remote monitoring by a control center. The heterogeneous hardware is accommodated by the use of open technology standards and a software architecture that is portable, modular, and highly configurable. We present an experimental evaluation of our structural-assessment network done using a full-scale three-story reinforced concrete building that was tested under lateral forces emulating forces induced by earthquakes. Our results show that a set of 12 strategically positioned sensors achieved a 100% detection rate for cracks crossing sensors and a zero false-alarm rate (in the sense that all signals exceeding a preset threshold were traced to cracks exceeding a specified total width).
Keywords :
condition monitoring; crack detection; structural engineering; wireless sensor networks; cracks crossing sensors; cracks detection; critical structural elements; custom-built gages; low-data-rate rapid structural assessment network; structural health monitoring; three-story reinforced concrete building; wireless sensor network; Buildings; Communication system control; Concrete; Data acquisition; Hardware; Remote monitoring; Software architecture; Software standards; Testing; Wireless sensor networks; Crack detection and localization; RFID; structural assessment network; wireless sensor network;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2009.2019355