• DocumentCode
    1452017
  • Title

    SDX: a novel self-aligned technique and its application to high-speed bipolar LSIs

  • Author

    Yamamoto, Yousuke ; Sakuma, Kazuhito

  • Author_Institution
    LSI Lab., NTT, Kanagawa, Japan
  • Volume
    35
  • Issue
    10
  • fYear
    1988
  • fDate
    10/1/1988 12:00:00 AM
  • Firstpage
    1601
  • Lastpage
    1608
  • Abstract
    A novel polysilicon selective-deposition method named selective deposition by exdiffusion (SDX) and a self-aligned bipolar LSI process using the SDX process are presented. The SDX process makes it possible to selectively form polysilicon patterns on silicon oxide patterns but not on silicon nitride patterns, where these patterns are formed on a silicon substrate surface. Bipolar transistor self-alignment between the isolation pattern and the entire transistor active region can be achieved in a 0.85-μm silicon island by the SDX process. A transistor with a 12-GHz cutoff frequency, an LCML gate with a propagation delay time of 59 ps/gate, and a 1-kb ECL (emitter-coupled logic) memory with an access time of 0.95 ns have been achieved
  • Keywords
    bipolar integrated circuits; emitter-coupled logic; integrated circuit technology; large scale integration; 0.85 micron; 0.95 ns; 12 GHz; ECL; LCML gate; SDX process; Si; Si-SiO2; access time; exdiffusion; high-speed bipolar LSIs; memory; propagation delay time; selective deposition; self-aligned technique; self-alignment; Acceleration; Bipolar transistors; Capacitance; Cutoff frequency; Large scale integration; Propagation delay; Semiconductor films; Silicon; Space technology; Substrates;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.7360
  • Filename
    7360