DocumentCode
1452017
Title
SDX: a novel self-aligned technique and its application to high-speed bipolar LSIs
Author
Yamamoto, Yousuke ; Sakuma, Kazuhito
Author_Institution
LSI Lab., NTT, Kanagawa, Japan
Volume
35
Issue
10
fYear
1988
fDate
10/1/1988 12:00:00 AM
Firstpage
1601
Lastpage
1608
Abstract
A novel polysilicon selective-deposition method named selective deposition by exdiffusion (SDX) and a self-aligned bipolar LSI process using the SDX process are presented. The SDX process makes it possible to selectively form polysilicon patterns on silicon oxide patterns but not on silicon nitride patterns, where these patterns are formed on a silicon substrate surface. Bipolar transistor self-alignment between the isolation pattern and the entire transistor active region can be achieved in a 0.85-μm silicon island by the SDX process. A transistor with a 12-GHz cutoff frequency, an LCML gate with a propagation delay time of 59 ps/gate, and a 1-kb ECL (emitter-coupled logic) memory with an access time of 0.95 ns have been achieved
Keywords
bipolar integrated circuits; emitter-coupled logic; integrated circuit technology; large scale integration; 0.85 micron; 0.95 ns; 12 GHz; ECL; LCML gate; SDX process; Si; Si-SiO2; access time; exdiffusion; high-speed bipolar LSIs; memory; propagation delay time; selective deposition; self-aligned technique; self-alignment; Acceleration; Bipolar transistors; Capacitance; Cutoff frequency; Large scale integration; Propagation delay; Semiconductor films; Silicon; Space technology; Substrates;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.7360
Filename
7360
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