Title :
A novel high speed multitap bus structure
Author :
Barber, V. Alan ; Lee, Keunmyung ; Obermaier, Hannsjörg
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fDate :
2/1/2001 12:00:00 AM
Abstract :
Reducing reflections, noise, and settling time on a bus through unique selections of node terminations, bus characteristic impedance, and bus construction allows dramatically higher operating speed. The new structure is described, the theory discussed, and results from fully operational physical and electrical implementations are presented
Keywords :
high-speed integrated circuits; integrated circuit interconnections; packaging; system buses; bus characteristic impedance; bus construction; electrical implementations; high speed multitap bus structure; node terminations; noise; operating speed; reflections; settling time; Acoustic reflection; Bandwidth; Clocks; Distributed parameter circuits; Driver circuits; Impedance; Integrated circuit interconnections; Power transmission lines; System performance; Transmission line theory;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.909625
