Title :
Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages
Author :
Ponchak, George E. ; Chun, Donghoon ; Yook, Jong-Gwan ; Katehi, Linda P B
Author_Institution :
Electron Devices Technol. Branch, NASA Glenn Res. Center, Cleveland, OH, USA
fDate :
2/1/2001 12:00:00 AM
Abstract :
Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line
Keywords :
ceramic packaging; crosstalk; finite element analysis; microstrip lines; shielding; 3-D-FEM simulations; LTCC packages; adjacent microstrip lines; attenuation characteristics; circuit performance; crosstalk control; dense RF packages; low temperature cofired ceramic; metal filled via hole fences; shielding structures; Attenuation; Circuit optimization; Circuit simulation; Coupling circuits; Degradation; Electromagnetic coupling; Microstrip; Packaging; Radio frequency; Strips;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.909628
