Title :
A 100-Gb/s throughput ATM switch MCM with a 320-channel parallel optical I/O interface
Author :
Kawano, Ryusuke ; Yamanaka, Naoaki ; Oki, Eiji ; Yasukawa, Seisho ; Okazaki, Katsuhiko ; Ohki, Akira ; Usui, Mitsuo ; Sato, Nobuo ; Katsura, Kosuke ; Ando, Yasuhiro ; Kagawa, Toshiaki ; Hikita, Makoto
Author_Institution :
Ultra-High-Speed Module Div., Nippon Telegraph & Telephone Corp., Kanagawa, Japan
fDate :
2/1/2001 12:00:00 AM
Abstract :
For an ATM switch system, we have developed a 100-Gb/s input/output (I/O) throughput optical I/O interface ATM switch multichip module (MCM) that has 320-ch optical I/O ports. This MCM is fabricated using ceramic (MCM-C) technology and very-small highly-parallel O/E and E/O optical converters. It uses 0.25-μm complementary metal oxide semiconductors (CMOS) ATM switch large scale integrations (LSIs) and has a total I/O throughput of up to 160 Gb/s. A prototype module with total I/O throughput of 100 Gb/s has been partially assembled using eight optical I/O interface blocks, each composed of a 40-ch O/E converter and a 40-ch E/O converter; the data rate per channel is from dc to 700 Mb/s. Using this module we developed an optical I/O interface ATM switch system and confirmed the operation of the optical interface
Keywords :
asynchronous transfer mode; ceramic packaging; large scale integration; multichip modules; multimedia communication; optical interconnections; photonic switching systems; 0.25 micron; 100 to 160 Gbit/s; ATM switch MCM; CMOS; LSIs; ceramic technology; highly-parallel E/O optical converters; highly-parallel O/E optical converters; interface blocks; optical I/O ports; parallel optical I/O interface; Assembly; Asynchronous transfer mode; CMOS technology; High speed optical techniques; Large scale integration; Optical interconnections; Optical switches; Prototypes; Switching systems; Throughput;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.909631
