DocumentCode
1453172
Title
Ion implantation model considering crystal structure effects
Author
Hane, M. ; Fukuma, Masao
Author_Institution
NEC Corp., Sagamihara, Japan
Volume
37
Issue
9
fYear
1990
fDate
9/1/1990 12:00:00 AM
Firstpage
1959
Lastpage
1963
Abstract
An ion implantation model for crystalline targets is proposed. The model is based on the Monte Carlo method. Ion behavior is determined by directly referring to three-dimensional crystal structure data. Both channeling and dechanneling can be well simulated by modeling many-body scattering with lattice atoms and introducing atom thermal vibration effects. This model is used to simulate low-energy boron implantation in crystal silicon. Significant boron distribution tail spreading is predicted due to subchanneling effects, even if the ion beam is tilted and/or the crystal surface is covered with amorphous layers. These predictions agree with experimental data. Amorphization effects on two-dimensional boron distribution were also investigated. It was predicted that locally insufficient preamorphization causes marked lateral spreading of boron
Keywords
Monte Carlo methods; amorphisation; boron; channelling; crystal atomic structure of elements; doping profiles; elemental semiconductors; ion implantation; many-body problems; silicon; Monte Carlo method; Si:B; amorphization effects; amorphous layers; atom thermal vibration effects; boron distribution tail spreading; boron implantation; channeling; crystal structure effects; crystalline targets; dechanneling; ion beam; ion behaviour; ion implantation model; lateral spreading; lattice atoms; many-body scattering; preamorphization; subchanneling effects; three-dimensional crystal structure; Amorphous materials; Atomic layer deposition; Boron; Crystallization; Ion beams; Ion implantation; Lattices; Probability distribution; Scattering; Silicon;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.57156
Filename
57156
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