Title :
A novel macromodel for power estimation in CMOS structures
Author :
Turgis, S. ; Auvergne, D.
Author_Institution :
Texas Instrum., Villeneuve-Loubet, France
fDate :
11/1/1998 12:00:00 AM
Abstract :
We present in this paper a novel alternative for the internal power-dissipation estimation of CMOS structures. A first order macromodeling is developed, considering full submicronic additional effects such as input slew dependency of short-circuit currents and input-to-output coupling. We introduce a novel equivalent capacitance concept allowing a direct and frequency-independent comparison of the different power components. A direct link between fanout and input/output slew is studied in order to derive design-oriented analytical macromodels for the internal power components. Validations are presented by comparing simulated values (HSPICE level 6 foundry model 0.65 μm) of power components to calculated values over a wide range of inverter configurations and control conditions. Discussion is given on a first-order generalization of this macromodel to gates. Evidence is given in terms of fanout and equivalent capacitance ratio of the controlling slope contribution on the internal power-dissipation components
Keywords :
CMOS digital integrated circuits; SPICE; capacitance; circuit simulation; integrated circuit design; integrated circuit modelling; logic CAD; low-power electronics; 0.65 micron; CMOS structures; HSPICE; control conditions; design-oriented analytical macromodels; equivalent capacitance concept; equivalent capacitance ratio; fanout; first-order generalization; frequency-independent comparison; full submicronic additional effects; input slew dependency; input-to-output coupling; internal power-dissipation estimation; inverter configurations; power estimation; Capacitance; Circuit simulation; Delay estimation; Design optimization; Foundries; Frequency; Leakage current; Power dissipation; Semiconductor device modeling; Signal design;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on