• DocumentCode
    1453706
  • Title

    Transmission line matrix modeling of disperse wide-band absorbing boundaries with time-domain diakoptics for S-parameter extraction

  • Author

    Eswarappa ; Costache, George I. ; Hoefer, Wolfgang J R

  • Author_Institution
    Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
  • Volume
    38
  • Issue
    4
  • fYear
    1990
  • fDate
    4/1/1990 12:00:00 AM
  • Firstpage
    379
  • Lastpage
    386
  • Abstract
    A numerical modeling procedure based on Johns time-domain diakoptics approach with space interpolation techniques for efficient transmission-line matrix (TLM) analysis of two-dimensional microwave circuits is discussed. Frequency-dispersive boundaries are represented in the time domain by their characteristic impulse response or numerical Green´s function (Johns matrix). Almost perfect wide-band absorbing boundary conditions have been obtained with this technique, permitting accurate characterization of waveguide discontinuities and compounds. The application of these techniques saves considerable computer run time and memory when compared with conventional TLM analysis
  • Keywords
    Green´s function methods; S-parameters; distributed parameter networks; interpolation; microwave circuits; network topology; transmission line theory; waveguide components; Johns matrix; S-parameter extraction; TLM analysis; accurate characterization; characteristic impulse response; disperse wide-band absorbing boundaries; frequency dispersive boundaries; numerical Green´s function; numerical modeling procedure; space interpolation techniques; time-domain diakoptics; transmission line matrix modelling; two-dimensional microwave circuits; waveguide components; waveguide discontinuities; Diakoptics; Distributed parameter circuits; Interpolation; Microwave circuits; Microwave theory and techniques; Numerical models; Time domain analysis; Transmission line matrix methods; Transmission lines; Wideband;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.52578
  • Filename
    52578