• DocumentCode
    1454024
  • Title

    A fast multipole-method-based calculation of the capacitance matrix for multiple conductors above stratified dielectric media

  • Author

    Pan, Yuancheng C. ; Chew, Weng Cho ; Wan, L.X.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    49
  • Issue
    3
  • fYear
    2001
  • fDate
    3/1/2001 12:00:00 AM
  • Firstpage
    480
  • Lastpage
    490
  • Abstract
    An efficient static fast-multipole-method (FMM)-based algorithm is presented in this paper for the evaluation of the parasitic capacitance of three-dimensional microstrip signal lines above stratified dielectric media. The effect of dielectric interfaces on the capacitance matrix is included in the stage of FMM when outgoing multipole expansions are used to form local multipole expansions by the use of interpolated image outgoing-to-local multipole translation functions. The increase in computation time and memory usage, compared to the free-space case, is, therefore, small. The algorithm retains O(N) computational and memory complexity of the free-space FMM, where N is the number of conductor patches
  • Keywords
    UHF integrated circuits; capacitance; computational complexity; conductors (electric); interpolation; microstrip lines; microwave integrated circuits; capacitance matrix; computation time; computational complexity; conductor patches; dielectric interfaces; free-space case; interpolated image outgoing-to-local multipole translation functions; memory complexity; memory usage; multiple conductors; multipole-method-based calculation; parasitic capacitance; stratified dielectric media; three-dimensional microstrip signal lines; Computational efficiency; Conductors; Dielectrics; Integral equations; Iterative algorithms; Iterative methods; Military computing; Parasitic capacitance; Transmission line matrix methods; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.910552
  • Filename
    910552