• DocumentCode
    1454185
  • Title

    Realisation of silicon piezoresistive accelerometer with proof mass-edge-aligned-flexures using wet anisotropic etching

  • Author

    Ravi Sankar, A. ; Grace Jency, J. ; Ashwini, J. ; Das, S.

  • Author_Institution
    Sch. of Electron. Eng., VIT Univ., Chennai, India
  • Volume
    7
  • Issue
    2
  • fYear
    2012
  • Firstpage
    118
  • Lastpage
    121
  • Abstract
    This Letter presents simulation, fabrication and testing of a high-performance quad-beam silicon piezoresistive accelerometer with very low cross-axis sensitivity. Cross-axis sensitivity in piezoresistive accelerometers is an important issue particularly for high-performance applications. In the present Letter, low cross-axis sensitivity is achieved by improving the device stability by placing four flexures in line with the proof mass edges. The accelerometer device is realised in a single-step double-sided bulk micromachining technique using a 5% dual- doped tetra methyl ammonium hydroxide solution as an anisotropic etchant. Test results of four fabricated devices show an average prime- axis sensitivity of 559.5 μV/g/5 V, a maximum cross-axis sensitivity of 0.62% full scale (FS acceleration = 13 g) of the prime-axis sensitivity and nonlinearity at a level of 0.5% of FS which are comparatively better than already reported devices and commercially available piezoresistive sensors.
  • Keywords
    accelerometers; elemental semiconductors; etching; micromachining; piezoresistive devices; silicon; Si; anisotropic etchant; cross-axis sensitivity; device stability; high-performance quad-beam silicon piezoresistive accelerometer; piezoresistive sensor; proof mass-edge-aligned-flexure; single-step double-sided bulk micromachining technique; wet anisotropic etching;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2011.0717
  • Filename
    6156032