450MM or bust?

The paper presents the cutting cost that the chipmakers wants by moving pizza-sized wafers, but could it prove to be an expensive mistake. The question is whether, if they decide to push ahead, the chipmakers can organise a less messy transition and, in doing so, bring the equipment suppliers with them. The plan is to coordinate their efforts through a joint pilot line operated by companies who want 450 mm production. They have yet to decide on a location or how the project will be managed but the chipmaking R&D centre in Albany, New York is the prime candidate right now. However, there will be other R&D locations. Intel´s latest R&D fab is designed to handle 450nm wafers as is the new clean room at IMEC in Belgium.