• DocumentCode
    145532
  • Title

    Tamper Resistance Verification Method for Consumer Security Products

  • Author

    Yoshikawa, Masatoshi ; Asai, Tetsuya

  • Author_Institution
    Dept. of Inf. Eng., Meijo Univ., Nagoya, Japan
  • Volume
    2
  • fYear
    2014
  • fDate
    10-13 March 2014
  • Firstpage
    30
  • Lastpage
    33
  • Abstract
    Consumer security products handling confidential information are secured by encrypting data. The encryption standard, which has been widely diffused in recent years, is certified that its decryption is computationally impossible. However, it was recently reported that even if an encryption algorithm is theoretically secured, when the algorithm is incorporated into hardware, confidential information about the algorithm could be improperly revealed using power consumption data when the hardware is operated. Such improper specifications are generally called side-channel attacks. Therefore, when an encryption algorithm is incorporated into hardware, evaluation of the resistance against power analysis attacks (tamper resistance) becomes important in the design stage of the circuit. The present study proposes a new method for efficient verification of tamper resistance against power analysis attacks when designing a cryptography circuit. The validity of the proposed method is confirmed using design data of an experimentally produced chip of the advanced encryption standard (AES).
  • Keywords
    cryptography; AES; advanced encryption standard; confidential information; consumer security products; cryptography circuit; encryption algorithm; power analysis attacks; power consumption data; side-channel attacks; tamper resistance verification method; Analytical models; Encryption; Integrated circuit modeling; Power demand; Resistance; SPICE; Security products; Side-channel attacks; Tamper verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Science and Computational Intelligence (CSCI), 2014 International Conference on
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/CSCI.2014.90
  • Filename
    6822299