Title :
Modeling via hole grounds in microstrip
Author :
Goldfarb, Marc E. ; Puce, Robert A.
Author_Institution :
Raytheon Inc., Lexington, MA, USA
fDate :
6/1/1991 12:00:00 AM
Abstract :
A simple model for a cylindrical via hole in a microstrip is presented. The model is based on a modification of the inductance of a cylindrical conductor as derived from Maxwell´s equations. The model was verified experimentally, and is corroborated by other solutions using numerical techniques.<>
Keywords :
inductance; modelling; strip lines; Maxwell´s equations; cylindrical conductor; cylindrical via hole; inductance; microstrip; model; via hole grounds; Conductors; Foundries; Inductance measurement; Maxwell equations; Metallization; Microstrip components; Moment methods; Numerical simulation; Springs; Topology;
Journal_Title :
Microwave and Guided Wave Letters, IEEE
