DocumentCode :
1455617
Title :
A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS
Author :
Shih, Chen-Luen ; Lai, Bo-Kuai ; Kahn, Harold ; Phillips, Stephen M. ; Heuer, Arthur H.
Author_Institution :
Dept. of Mater. Sci. & Eng., Case Western Reserve Univ., Cleveland, OH, USA
Volume :
10
Issue :
1
fYear :
2001
fDate :
3/1/2001 12:00:00 AM
Firstpage :
69
Lastpage :
79
Abstract :
Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described
Keywords :
batch processing (industrial); microactuators; nickel alloys; shape memory effects; sputter deposition; titanium alloys; MEMS; TiNi; batch fabrication; co-sputtering fabrication procedure; equiatomic thin films; microactuators; production environment; shape memory alloys; transformation temperatures; Fabrication; Micromechanical devices; Production; Robustness; Shape memory alloys; Sputtering; Substrates; Temperature distribution; Temperature sensors; Transistors;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.911094
Filename :
911094
Link To Document :
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