DocumentCode
1455787
Title
Multiobjective optimization of VLSI interconnect parameters
Author
Anand, M.B. ; Shibata, Hideki ; Kakumu, Masakazu
Author_Institution
ULSI Process Eng. Lab., Toshiba Corp., Yokohama, Japan
Volume
17
Issue
12
fYear
1998
fDate
12/1/1998 12:00:00 AM
Firstpage
1252
Lastpage
1261
Abstract
The significant role played by interconnects in determining the speed and chip size of very-large-scale integrated circuits (VLSI) necessitates the development of new processes and tools for almost every device generation. Since such development usually requires lead times of several years, it has become essential to know, several years in advance, the various interconnect parameters for a particular generation. In this paper, a tool for optimizing interconnect parameters is presented. The formulation of an optimization problem that can be solved using standard algorithms is shown to be possible, and the optimization results obtained for future device generations are discussed. These results can be used to construct an interconnect technology roadmap. Last, shortcomings of and possible improvements to existing system-level critical path models are discussed
Keywords
VLSI; circuit CAD; circuit optimisation; critical path analysis; integrated circuit design; integrated circuit interconnections; VLSI; chip size; interconnect parameters; multiobjective optimization; standard algorithms; system-level critical path models; technology roadmap; Dielectric materials; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit synthesis; Integrated circuit technology; Large scale integration; Parasitic capacitance; Power system modeling; Very large scale integration; Wire;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.736565
Filename
736565
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