• DocumentCode
    1455937
  • Title

    New copper cladding method to help relieve metal shortage

  • Volume
    71
  • Issue
    2
  • fYear
    1952
  • Firstpage
    197
  • Lastpage
    199
  • Abstract
    A new process whereby copper is bonded inseparably to steel was demonstrated recently in the metallurgical laboratory of the James H. Herron Company, Cleveland, Ohio. This process produces a bimetal in which the copper is bonded to the steel and may be the answer to the civilian need for the material of a thousand uses-copper.
  • Keywords
    Cameras; Companies; Copper; Power systems; Production; Steel;
  • fLanguage
    English
  • Journal_Title
    Electrical Engineering
  • Publisher
    ieee
  • ISSN
    0095-9197
  • Type

    jour

  • DOI
    10.1109/EE.1952.6437975
  • Filename
    6437975