DocumentCode
1455969
Title
Mechanical Behavior Analysis of a Test Coil for MICE Coupling Solenoid During Quench
Author
Pan, H. ; Wang, L. ; Guo, X.L. ; Wu, H. ; Green, M.A.
Author_Institution
Inst. of Cryogenics & Supercond. Technol., Harbin Inst. of Technol., Harbin, China
Volume
20
Issue
3
fYear
2010
fDate
6/1/2010 12:00:00 AM
Firstpage
1892
Lastpage
1895
Abstract
The coupling magnet for the Muon Ionization Cooling Experiment has a self-inductance of 592 H and the magnet stored energy of 13 MJ at a full current of 210 A for the worst operation case of the MICE channel. During a quench, the stored energy and the high conductor current density will cause a large temperature rise and induce considerable impact of stresses. One test coil was built in order to validate the design method and practice the stress and strain situation which occurs in the coupling coil. In this study, the analysis on stress redistribution in the sub-divided winding during a quench was performed. The stress variation may bring about failure of epoxy resin, which is the cause of a new normal zone arising. Spring model for impregnating epoxy and fiber-glass cloth in the coil was used to evaluate the mechanical disturbance by impregnated materials failure. This paper presents the detailed dynamic stress and stability analysis to assess the stress distribution during the quench process and to check whether the transient loads are acceptable for the magnet.
Keywords
accelerator magnets; resins; solenoids; superconducting coils; superconducting magnet energy storage; superconducting magnets; MICE coupling solenoid; Muon Ionization Cooling Experiment; conductor current density; current 210 A; energy 13 MJ; epoxy resin failure; fiber glass cloth; magnet stored energy; mechanical behavior analysis; mechanical disturbance; quench; self inductance; spring model; stability analysis; stress variation; temperature rise; test coil; Dynamic stress; MICE superconducting magnet; quench; stability;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2010.2042943
Filename
5439733
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