DocumentCode
1456014
Title
Selective epitaxial growth silicon bipolar transistors for material characterization
Author
Siekkinen, James W. ; Klaasen, William A. ; Neudeck, Gerold W.
Author_Institution
Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
35
Issue
10
fYear
1988
fDate
10/1/1988 12:00:00 AM
Firstpage
1640
Lastpage
1644
Abstract
In development of the epitaxial lateral overgrowth (ELO) bipolar transistor, devices were fabricated in silicon selective epitaxial growth (SEG). These devices were used to electrically characterize the quality of the SEG material. Three silicon bipolar transistors, with almost identical doping profiles and geometries were simultaneously fabricated on the same wafer and their electrical characteristics compared. The three transistors were located in the substrate, a single SEG layer, and a double (interrupted growth) SEG layer. The SEG silicon was grown in a reduced-pressure RF-heated pancake-type epitaxial reactor at 950°C and 150 torr. The transistors were tested for junction ideality factors, junction reverse-bias leakage currents, and forward DC current gain. Test results indicated the excellent device quality of the SEG material relative to the substrate
Keywords
bipolar transistors; elemental semiconductors; semiconductor epitaxial layers; semiconductor growth; silicon; 150 torr; 950 degC; SEG; Si; bipolar transistors; device quality; doping profiles; electrical characteristics; epitaxial lateral overgrowth; forward DC current gain; geometries; junction ideality factors; junction reverse-bias leakage currents; material characterization; reduced-pressure RF-heated pancake-type epitaxial reactor; selective epitaxial growth; Bipolar transistors; Doping profiles; Electric variables; Epitaxial growth; Geometry; Inductors; Leakage current; Silicon; Substrates; Testing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.7366
Filename
7366
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