DocumentCode
1456643
Title
A neural-network-based approach to determining a robust process recipe for the plasma-enhanced deposition of silicon nitride thin films
Author
Rosen, I. Gary ; Parent, Tyler ; Cooper, Carolyn ; Chen, Ping ; Madhukar, Anupam
Author_Institution
Dept. of Math., Univ. of Southern California, Los Angeles, CA, USA
Volume
9
Issue
2
fYear
2001
fDate
3/1/2001 12:00:00 AM
Firstpage
271
Lastpage
284
Abstract
We consider the problem of locating a process recipe that produces outputs which are, in some sense, least sensitive to small fluctuations in the process condition. Specifically, we determine the most robust process recipe for the plasma-enhanced chemical vapor deposition of silicon nitride thin films having specified optical properties. An appropriate sensitivity functional describing the relationship between the process inputs and outputs and their localized variability is defined in terms of response surfaces and the response surface gradients. Determining the most robust process recipes which produce films with a given refractive index is then formulated as a constrained minimization problem. The silicon nitride films are characterized by spectroscopic ellipsometry and the requisite response surfaces are obtained by training feedforward artificial neural networks with available data. Numerical findings are presented, validated via simulation, and discussed
Keywords
feedforward neural nets; minimisation; neurocontrollers; plasma CVD; process control; refractive index; semiconductor device manufacture; thin film devices; SiN; chemical vapor deposition; feedforward neural networks; minimization; plasma-enhanced deposition; process recipe; process variability; refractive index; sensitivity functional; silicon nitride thin films; spectroscopic ellipsometry; Chemical vapor deposition; Fluctuations; Optical films; Plasma chemistry; Plasma properties; Response surface methodology; Robustness; Semiconductor thin films; Silicon; Sputtering;
fLanguage
English
Journal_Title
Control Systems Technology, IEEE Transactions on
Publisher
ieee
ISSN
1063-6536
Type
jour
DOI
10.1109/87.911379
Filename
911379
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