• DocumentCode
    1457630
  • Title

    New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components

  • Author

    Pucci, Elena ; Rajo-Iglesias, Eva ; Kildal, Per-Simon

  • Author_Institution
    Dept. of Signals & Syst., Chalmers Univ. of Technol., Gothenburg, Sweden
  • Volume
    22
  • Issue
    3
  • fYear
    2012
  • fDate
    3/1/2012 12:00:00 AM
  • Firstpage
    129
  • Lastpage
    131
  • Abstract
    The gap waveguide has been recently presented as a new transmission line technology using artificial magnetic conductors (AMCs) to allow the wave propagation only along a desired path. The first validation has been provided using a lid of metal pins as AMC for high frequency applications. In this letter, simulations and measurement results are presented for another version called microstrip gap waveguide, working as inverted microstrip line and realized using a mushroom-type EBG surface. The transmission line is surrounded by mushrooms which create a parallel plate stop band, suppressing cavity modes and unwanted radiations compared to standard packaged microstrip transmission lines. The field propagates in the air gap between the upper lid and the mushrooms layer, providing a low loss compact circuit made in printed technology.
  • Keywords
    conducting bodies; electronics packaging; microstrip lines; photonic band gap; AMC; air gap; artificial magnetic conductor; cavity mode; inverted microstrip line; metal pins; microstrip gap waveguide; microwave component packaging; mushroom-type EBG; parallel plate stop band; transmission line technology; wave propagation; Electromagnetic waveguides; Metals; Metamaterials; Microstrip; Periodic structures; Transmission line measurements; Waveguide discontinuities; Gap waveguides; microstrip lines; mushrooms-type electromagnetic band-gap (EBG); packaging;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2011.2182638
  • Filename
    6157653