DocumentCode
1457630
Title
New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components
Author
Pucci, Elena ; Rajo-Iglesias, Eva ; Kildal, Per-Simon
Author_Institution
Dept. of Signals & Syst., Chalmers Univ. of Technol., Gothenburg, Sweden
Volume
22
Issue
3
fYear
2012
fDate
3/1/2012 12:00:00 AM
Firstpage
129
Lastpage
131
Abstract
The gap waveguide has been recently presented as a new transmission line technology using artificial magnetic conductors (AMCs) to allow the wave propagation only along a desired path. The first validation has been provided using a lid of metal pins as AMC for high frequency applications. In this letter, simulations and measurement results are presented for another version called microstrip gap waveguide, working as inverted microstrip line and realized using a mushroom-type EBG surface. The transmission line is surrounded by mushrooms which create a parallel plate stop band, suppressing cavity modes and unwanted radiations compared to standard packaged microstrip transmission lines. The field propagates in the air gap between the upper lid and the mushrooms layer, providing a low loss compact circuit made in printed technology.
Keywords
conducting bodies; electronics packaging; microstrip lines; photonic band gap; AMC; air gap; artificial magnetic conductor; cavity mode; inverted microstrip line; metal pins; microstrip gap waveguide; microwave component packaging; mushroom-type EBG; parallel plate stop band; transmission line technology; wave propagation; Electromagnetic waveguides; Metals; Metamaterials; Microstrip; Periodic structures; Transmission line measurements; Waveguide discontinuities; Gap waveguides; microstrip lines; mushrooms-type electromagnetic band-gap (EBG); packaging;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2011.2182638
Filename
6157653
Link To Document