• DocumentCode
    1458139
  • Title

    Thermal stress in EML rail-conductor overlays

  • Author

    Satapathy, Sikhanda ; Persad, Chadee

  • Author_Institution
    Inst. for Adv. Technol., Texas Univ., Austin, TX, USA
  • Volume
    37
  • Issue
    1
  • fYear
    2001
  • fDate
    1/1/2001 12:00:00 AM
  • Firstpage
    269
  • Lastpage
    274
  • Abstract
    In an electromagnetic (EM) railgun, a thin, unbonded overlay on the rail conductor develops residual strains as evident from its post-shot curvature. Heating due to the transient EM field and a large thermal gradient due to deposition of a molten layer of armature material contribute to the straining of the overlay. In this paper, the authors solved the one-dimensional coupled magnetic and thermal diffusion equations to estimate the thermal gradient in the overlay. Heat sources included both Joule heating and the enthalpy from a resolidified thin layer of molten aluminum deposited by the armature. The thermal gradient so calculated was used in a one-dimensional stress model to compute residual stresses from which residual curvature was calculated. The calculated curvature compares well with the experimental value. Finally, based on the estimated residual stress, they present an estimate for the remaining life of the overlay
  • Keywords
    electromagnetic fields; railguns; temperature distribution; thermal analysis; thermal diffusion; thermal stresses; EM launcher rail-conductor overlays; Joule heating; armature material layer deposition; electromagnetic railgun; one-dimensional coupled magnetic-thermal diffusion equations; post-shot curvature; remaining life estimation; residual curvature; residual stresses; resolidification enthalpy; thermal gradient; thermal stress studies; transient EM field; Conducting materials; Electromagnetic transients; Heating; Life estimation; Magnetic field induced strain; Magnetic materials; Railguns; Rails; Residual stresses; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.911835
  • Filename
    911835