Title :
Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs
Author :
Li, Hong ; Xu, Chuan ; Banerjee, Kaustav
Author_Institution :
Univ. of California, Santa Barbara, CA, USA
Abstract :
Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains.
Keywords :
carbon nanotubes; integrated circuits; microprocessor chips; performance evaluation; carbon nanomaterials; carbon nanotubes; copper interconnection; electrical performance analysis; graphene nanoribbons; next-generation IC; technology interconnection; RF or wireless interconnects; carbon nanomaterials; carbon nanotube (CNT); delay; design and test; electrical interconnects; graphene nanoribbon (GNR); on-chip vias; optical interconnects; power; through-silicon vias (TSVs);
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2010.55
