• DocumentCode
    1459029
  • Title

    Thermal Management Challenges in Telecommunication Systems and Data Centers

  • Author

    Garimella, Suresh V. ; Yeh, Lian-Tuu ; Persoons, Tim

  • Author_Institution
    Cooling Technol. Res. Center, Purdue Univ., West Lafayette, IN, USA
  • Volume
    2
  • Issue
    8
  • fYear
    2012
  • Firstpage
    1307
  • Lastpage
    1316
  • Abstract
    The framework for this paper is the growing concern about the worldwide increasing energy consumption of telecommunications systems and data centers, and particularly the contribution of the thermal management system. The present energy usage of these systems is discussed, as well as the relationship between cooling system design and the total cost of ownership. This paper identifies immediate and future thermal bottlenecks facing the industry, ranging from technological issues at the component and system level to more general needs involving reliability, modularity, and multidisciplinary design. Based on this enumeration, the main challenges to implementing cooling solutions are reviewed. Particular attention is paid to implementing liquid cooling, since this technology seems the most promising to addressing the key thermal bottlenecks, and improving the future sustainability of thermal management in the telecom and data center industry. Finally, an outlook is presented toward future potential challenges.
  • Keywords
    computer centres; cooling; energy consumption; reliability; telecommunication network management; thermal management (packaging); cooling system design; data centers; energy consumption; modularity; multidisciplinary design; reliability; telecommunication systems; thermal bottlenecks; thermal management; total ownership cost; Cooling; Energy consumption; Heat recovery; Space heating; Telecommunications; Waste heat; Central office; communication networks; energy management; thermal management of electronics;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2185797
  • Filename
    6159062