Built-up Mica plate for high-temperature applications
Author :
Dawes, C. L.
Author_Institution :
Harvard University, Cambridge, Mass., and New England Mica Company, Waltham, Mass.
Volume :
72
Issue :
2
fYear :
1953
Firstpage :
145
Lastpage :
150
Abstract :
Certain developments in the field of built-up bonded mica products for use as electrical insulation are described with emphasis placed on high-temperature applications.
Keywords :
Conductivity; Humidity; Insulation; Leakage current; Metals; Resistance; Temperature measurement;