DocumentCode
1459395
Title
Mass transport characteristics in a pulsed plasma enhanced chemical vapor deposition reactor for thin polymer film deposition
Author
Goyal, Kumud O. ; Mahalingam, R. ; Pedrow, Patrick D. ; Osman, Mohamed A.
Author_Institution
Dept. of Chem. Eng., Washington State Univ., Pullman, WA, USA
Volume
29
Issue
1
fYear
2001
fDate
2/1/2001 12:00:00 AM
Firstpage
42
Lastpage
50
Abstract
A pulsed plasma enhanced chemical vapor deposition (PECVD) reactor is used for the preparation of thin polyacetylene films. A theoretical model based on the mass transport characteristics of the reactor is developed in order to correlate with experimentally obtained spatial deposition profiles for the acetylene plasma polymer film deposited within the cylindrical reactor. Utilizing a free radical mechanism with gas phase initiation of the polymerization reaction as the rate controlling step, a system parametric study is performed to predict the Peclet number range of operation for the pulsed PECVD reactor. This parametric study indicates radical decay by diffusion to the reactor walls to be the significant physical phenomenon in the system. It is concluded that a quasi-steady-state model is a good tool for predicting the important mass transfer phenomena occurring in the pulsed plasma reactor
Keywords
plasma CVD; plasma chemistry; plasma transport processes; polymer films; polymerisation; Peclet number; acetylene plasma polymer film; cylindrical reactor; free radical mechanism; gas phase initiation; mass transfer phenomena; mass transport characteristics; parametric study; polymerization reaction; pulsed plasma enhanced chemical vapor deposition reactor; pulsed plasma reactor; quasi-steady-state model; radical decay; rate controlling step; reactor walls; spatial deposition profiles; theoretical model; thin polyacetylene films; thin polymer film deposition; Chemical vapor deposition; Inductors; Plasma applications; Plasma chemistry; Plasma materials processing; Plasma properties; Plasma temperature; Plasma transport processes; Polymer films; Substrates;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/27.912940
Filename
912940
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