A Domain Decomposition Approach for Efficient Electromagnetic Analysis of the Power Distribution Network of Packaged Electronic Systems

A versatile electromagnetic modeling methodology is presented that is most suitable for use in the computer-aided design of the power distribution network (PDN) of packaged electronics. The method is characterized by modeling flexibility and computational efficiency. These attributes stem from the adoption of a modular approach for the development of the model, where the fine-feature, geometric discontinuities in the network, such as pins, vias, and splits in metallization layers, are modeled separately from the solid planar ground and power metallization portions. In this manner, multiport network models of these discontinuities are developed, making possible their expedient insertion in a discrete electromagnetic model for the solid portions of the metallization. The latter is based on a 2-D integral equation model for the cylindrical transverse electromagnetic field behavior between the metallization planes, for which only electrically important features are preserved and modeled. The utilization of a systematic decomposition approach further enhances the modeling versatility of the proposed method and enables the development of a modeling methodology that is suitable for computer-aided iteration in the electromagnetic performance-aware design of multilayer PDNs. Validation studies are used to demonstrate the efficiency of the proposed methodology and assess its accuracy as a computer-aided tool for PDN predesign.