• DocumentCode
    146036
  • Title

    Novel AlInN/GaN integrated circuits operating up to 500 °C

  • Author

    Gaska, R. ; Gaevski, M. ; Deng, Jiansong ; Jain, R. ; Simin, G. ; Shur, M.

  • Author_Institution
    Sensor Electron. Technol., Inc., Columbia, SC, USA
  • fYear
    2014
  • fDate
    22-26 Sept. 2014
  • Firstpage
    142
  • Lastpage
    145
  • Abstract
    High-temperature technology platform has been developed based on AlInN/GaN heterostructures. High electron concentration in 2DEG channel of AlInN/GaN devices is remarkably stable over a broad temperature range, enabling device operation above 500 °C. The developed IC technology is based on three key elements: (1) exceptional quality AlInN/GaN heterostructure with very high carrier concentration and mobility that enables IC fast operation in a broad temperature range; (2) heterostructure field effect transistor approach that provides fully planar IC structure which is easy to scale and to combine with the other high temperature electronic components; (3) fabrication advancements including novel metallization scheme and high-k passivation/gate dielectrics, specifically developed for high temperature operation. The feasibility of the technology was demonstrated by fabrication and testing inverter and differential amplifier ICs using AlInN/GaN heterostructures. At temperature exceeding 500°C, the developed ICs show stable performance with unit-gain bandwidth above 1 MHz and internal response time 45 ns*.
  • Keywords
    III-V semiconductors; carrier density; carrier mobility; differential amplifiers; field effect transistors; high-k dielectric thin films; high-temperature electronics; passivation; wide band gap semiconductors; 2DEG channel; AlInN-GaN; carrier concentration; carrier mobility; differential amplifier IC; heterostructure field effect transistor; high electron concentration; high temperature electronic components; high-k passivation/gate dielectrics; high-temperature technology; integrated circuits; Gallium nitride; HEMTs; Integrated circuits; MODFETs; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference (ESSDERC), 2014 44th European
  • Conference_Location
    Venice
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4799-4378-4
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2014.6948778
  • Filename
    6948778