DocumentCode :
1460385
Title :
A Compact and Embedded Balanced Bandpass Filter With Wideband Common-Mode Suppression on Wireless SiP
Author :
Chen, Hung-Chuan ; Tsai, Chung-Hao ; Wu, Tzong-Lin
Author_Institution :
Dept. of Electr. Eng. & Grad. Inst. of Commun. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
2
Issue :
6
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
1030
Lastpage :
1038
Abstract :
A compact balanced bandpass filter is proposed using a novel circuit topology, which includes a differential resonator and a common resonator in the conventional quasi-lumped coupled-line circuit, instead of adopting quarter-wavelength or half-wavelength transmission lines in the filter design. Based on this circuit topology, the balanced bandpass filter can support bandpass filtering function under differential-mode operation and exhibit bandstop filtering function under common-mode noise. By employing the advantage of the low-temperature co-fired ceramic fabrication technology, a compact balanced bandpass filter is centered at 3.42 GHz with fractional bandwidth 10.4% for differential signals and rejection band is from 1.48 to 7.4 GHz for the common-mode noise. Moreover, the proposed filter is able to introduce a transmission zero with excellent common-mode suppression (>;40 dB) within the differential-mode passband. The electrical size of this filter is 5.6 × 5.4 mm with the corresponding electrical size 0.113 × 0.109 λg, where λg is the guided wavelength at the center frequency 3.42 GHz. This compact balanced bandpass filter is suitable to be applied to the system-in-package technology for wireless application.
Keywords :
band-pass filters; ceramic packaging; coupled transmission lines; microwave filters; resonator filters; system-in-package; bandstop filtering function; bandwidth 1.48 GHz to 7.4 GHz; circuit topology; common-mode noise; differential resonator; differential-mode passband; embedded balanced bandpass filter; filter design; frequency 3.42 GHz; half-wavelength transmission lines; low-temperature cofired ceramic fabrication technology; quasilumped coupled-line circuit; system-in-package technology; transmission zero; wideband common-mode suppression; wireless SiP; Capacitance; Circuit topology; Filtering theory; Inductance; Inductors; Integrated circuit modeling; Resonant frequency; Balanced bandpass filter; common-mode filter; low-temperature co-fired ceramic (LTCC); lumped-element bandpass filter; transmission zero;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2186451
Filename :
6161628
Link To Document :
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