DocumentCode :
1460547
Title :
Reactor design considerations for MOCVD growth of thin films
Author :
Nami, Ziba ; Erbil, Ahmet ; May, Gary S.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
10
Issue :
2
fYear :
1997
fDate :
5/1/1997 12:00:00 AM
Firstpage :
295
Lastpage :
306
Abstract :
Metal-organic chemical vapor deposition (MOCVD) performance is optimized for growing titanium dioxide (TiO2) thin films. Different gas flow directions and susceptor rotation, along with reactor geometry and shape variations are considered. Gravity proves to be an important parameter in changing the flow pattern in the reaction chamber. However, since film uniformity is not improved by changing the flow direction, modifying the reactor geometry is also proposed. Among the different geometrical parameters, the susceptor-inlet distance, inlet tube diameter, and susceptor size are considered. To minimize the occurrence of recirculation cells in the reaction chamber, modifications in the reactor shape are also suggested. Acceptable results are achieved by changing the cylindrical reactor to a diamond shape
Keywords :
dielectric thin films; epitaxial layers; flow simulation; integrated circuit manufacture; titanium compounds; vapour phase epitaxial growth; MOCVD growth; MOCVD performance; TiO2; TiO2 thin films; cylindrical shape; diamond shape; film uniformity; gas flow directions; gravity; inlet tube diameter; metal-organic CVD; reaction chamber flow pattern; reactor design considerations; reactor geometry; reactor shape variations; recirculation cells; susceptor rotation; susceptor-inlet distance; Chemical vapor deposition; Fluid flow; Geometry; Gravity; Inductors; MOCVD; Shape; Sputtering; Titanium; Transistors;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.572085
Filename :
572085
Link To Document :
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