Title :
Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips
Author :
Harendt, Christine ; Zili Yu ; Burghartz, Joachim N. ; Kostelnik, Jan ; Kugler, Andreas ; Saller, Stefan
Author_Institution :
Inst. fur Mikroelektron. Stuttgart (IMS CHIPS), Stuttgart, Germany
Abstract :
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component.
Keywords :
flexible electronics; integrated circuit reliability; microprocessor chips; printed circuits; HySiF; embedded chips; embedded electronics; flexible electronics; hybrid systems in foil; large-area thin-film electronic elements; printed electronics; thin-chip assembly; thin-chip fabrication; thin-chip reliability; ultrathin flexible chips; Assembly; Flexible electronics; Integrated circuits; Reliability; Sensors; Silicon; Stress; bending stress measurement; chip warpage; embedded component technology; embedding; flexible electronics; hybrid system-in-foil; mechanical stability; ultra-thin chips;
Conference_Titel :
Solid State Device Research Conference (ESSDERC), 2014 44th European
Conference_Location :
Venice
Print_ISBN :
978-1-4799-4378-4
DOI :
10.1109/ESSDERC.2014.6948797
