• DocumentCode
    1460927
  • Title

    Electromagnetic and structural analyses of an integrated launch package

  • Author

    Liu, H.-P. ; Ting, Y.L. ; Zowarka, R.C. ; Alexander, A.

  • Author_Institution
    Center for Electromech., Texas Univ., Austin, TX, USA
  • Volume
    35
  • Issue
    1
  • fYear
    1999
  • fDate
    1/1/1999 12:00:00 AM
  • Firstpage
    74
  • Lastpage
    78
  • Abstract
    In this paper, detailed three-dimensional (3D) transient electromagnetic (EM) analyses with temperature-dependent material properties were performed using a state-of-the-art analysis tool to calculate current densities, body force densities, and temperature distribution in launch package and rail conductors. The body force densities, temperature distribution, and package accelerations generated by the EM model were then provided to a 3D multiple-step nonlinear static structural model for detailed mechanical analyses. The combined 3D EM and structural analyses can be used to accurately predict the EM launching performance and launch package structural integrity. Furthermore, armature optimization and package survivability enhancement can also be achieved with the help of these analyses
  • Keywords
    current density; electromagnetic fields; railguns; temperature distribution; transient analysis; 3D multiple-step nonlinear static structural model; 3D transient electromagnetic analyses; EM launching performance; EM model; armature optimization; body force densities; current densities calculation; electromagnetic analyses; integrated launch package; launch package; launch package structural integrity; mechanical analyses; package accelerations; package survivability enhancement; rail conductors; railgun; state-of-the-art analysis tool; structural analyses; temperature distribution; temperature-dependent material properties; Current density; Electromagnetic analysis; Electromagnetic forces; Electromagnetic launching; Electromagnetic transients; Material properties; Packaging; Performance analysis; Temperature distribution; Transient analysis;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.738379
  • Filename
    738379