MEM relay for reconfigurable RF circuits

Author

Mihailovich, R.E. ; Kim, M. ; Hacker, J.B. ; Sovero, E.A. ; Studer, J. ; Higgins, J.A. ; DeNatale, J.F.

Author_Institution

Rockwell Sci. Center, Thousand Oaks, CA, USA

Volume

11

Issue

2

fYear

2001

Firstpage

53

Lastpage

55

Abstract

We describe a microelectromechanical (MEM) relay technology for high-performance reconfigurable RF circuits. This microrelay, fabricated using surface micromachining, is a metal contact relay with electrical isolation between signal and drive lines. This relay provides excellent switching performance over a broad frequency band (insertion loss of 0.1 dB and isolation of 30 dB at 40 GHz), versatility in switch circuit configurations (microstrip and coplanar, shunt and series), and the capability for monolithic integration with high-frequency electronics. In addition, this MEM relay technology has demonstrated yields and lifetimes that are promising for RF circuit implementation.

Keywords

MIMIC; MMIC; integrated circuit yield; losses; micromachining; micromechanical devices; microwave switches; semiconductor relays; 0.1 dB; 40 GHz; MEM relay; electrical isolation; high-frequency electronics; insertion loss; lifetimes; metal contact relay; monolithic integration; reconfigurable RF circuits; surface micromachining; switch circuit configurations; switching performance; yields; Contacts; Insertion loss; Isolation technology; Micromachining; Microrelays; Performance loss; Radio frequency; Relays; Switches; Switching circuits;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/7260.914300

Filename

914300