• DocumentCode
    1461254
  • Title

    Testing ICs: getting to the core of the problem

  • Author

    Murray, Brian T. ; Hayes, John P.

  • Author_Institution
    Gen. Motors R&D Center, USA
  • Volume
    29
  • Issue
    11
  • fYear
    1996
  • fDate
    11/1/1996 12:00:00 AM
  • Firstpage
    32
  • Lastpage
    38
  • Abstract
    The article examines the market and technology trends affecting the testing of integrated circuits, with emphasis on the role of predesigned components-cores-and built in self test. We explain manufacturing testing, as opposed to design testing, which happens before manufacturing, and online testing, which happens after
  • Keywords
    built-in self test; computer testing; integrated circuit manufacture; integrated circuit testing; IC testing; built in self test; cores; integrated circuits; manufacturing testing; online testing; predesigned components; technology trends; Circuit faults; Circuit testing; Combinational circuits; Error correction; Fault detection; Pins; Semiconductor impurities; Sequential analysis; Sequential circuits; Signal processing;
  • fLanguage
    English
  • Journal_Title
    Computer
  • Publisher
    ieee
  • ISSN
    0018-9162
  • Type

    jour

  • DOI
    10.1109/2.544235
  • Filename
    544235