Title :
Correlation Between Oxide Trap Generation and Negative-Bias Temperature Instability
Author :
Boo, A.A. ; Ang, D.S. ; Teo, Z.Q. ; Leong, K.C.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fDate :
4/1/2012 12:00:00 AM
Abstract :
Evidence shows that substantial interface degradation under negative-bias temperature (NBT) stressing does not result in any apparent oxide trap generation. The link between NBT instability and oxide trap generation is actually found in the recoverable hole-trapping component (R) of the former. When R is constant, independent of the number of stress/relaxation cycles, no apparent oxide trap generation is observed in spite of nonnegligible interface degradation. However, when oxide trap generation occurs, a correlated decrease of R is observed. Analysis shows that the generated oxide traps are due to a portion of the trapped holes being transformed into a more permanent form. A possible explanation based on the oxygen vacancy defect is given.
Keywords :
MOSFET; electric breakdown; leakage currents; semiconductor device reliability; temperature; MOSFET; NBT instability; negative-bias temperature instability; negative-bias temperature stressing; nonnegligible interface degradation; oxide trap generation; oxygen vacancy defect; recoverable hole-trapping component; stress-relaxation cycles; substantial interface degradation; trapped holes; Correlation; Degradation; Leakage current; Logic gates; MOSFET circuits; Silicon; Stress; Bias temperature instability; MOSFET; defect relaxation; oxynitride; stress-induced leakage current (SILC); time-dependent dielectric breakdown;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2012.2185481