Failure Rates for Interconnect Dielectric Breakdown: Trends Determining Technology Reliability Scaling Limits

In this paper, the dielectric properties [dielectric constant κ and thickness d (in nanometers)] that are necessary for the reliable operation of interline dielectrics used for passivation of copper interconnects in integrated circuits are determined. By relating the field acceleration factor to the dielectric constant, the optimum dielectric properties needed for meeting industrial reliability targets are estimated. This fundamental analysis offers a method of rationally introducing new materials to meet technology performance goals while maintaining reliability targets.