DocumentCode
1461702
Title
Magnetization reversal processes in exchange-biased spin-valve structures
Author
Goodman, A.M. ; O´Grady, K. ; Laidler, H. ; Owen, N.W. ; Portier, X. ; Petford-Long, A.K. ; Cebollada, F.
Author_Institution
Magnetic Mater. Res. Group, Univ. of Wales, Bangor, UK
Volume
37
Issue
1
fYear
2001
fDate
1/1/2001 12:00:00 AM
Firstpage
565
Lastpage
570
Abstract
In this paper we provide an initial, qualitative description of the basic magnetization reversal processes that occur when a soft ferromagnetic layer is coupled to an antiferromagnet. We find that the magnetization reversal in the ferromagnetic layer adjacent to the antiferromagnet, i.e., the pinned layer, is dominated by thermal activation processes, We have developed, and report here, a model that accounts for seven distinct features of the magnetization curve of the pinned layer. The model is based upon the formation of domains in the antiferromagnetic layer whose growth is dominated by thermal activation processes. The thermal activation of these domain processes can result in shifts of the hysteresis loop in either direction, depending on the magnetic history of the sample and the rate of field sweep, In consequence, we call into question the current definition of the exchange field Hex typically used to characterize such systems
Keywords
antiferromagnetism; exchange interactions (electron); magnetic hysteresis; magnetic multilayers; magnetisation reversal; soft magnetic materials; spin valves; antiferromagnet; antiferromagnetic layer; exchange field; exchange-biased spin-valve structures; field sweep; hysteresis loop; magnetic history; magnetization curve; magnetization reversal processes; pinned layer; soft ferromagnetic layer; thermal activation processes; Anisotropic magnetoresistance; Antiferromagnetic materials; Couplings; Energy barrier; Magnetic anisotropy; Magnetic hysteresis; Magnetic materials; Magnetization reversal; Production; Transistors;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.914379
Filename
914379
Link To Document