Title :
A power efficient reconfigurable system-in-stack: 3D integration of accelerators, FPGAs, and DRAM
Author :
Gadfort, P. ; Dasu, Aravind ; Akoglu, Ali ; Yoon Kah Leow ; Fritze, Michael
Author_Institution :
Inf. Sci. Inst., Univ. of Southern California, Arlington, VA, USA
Abstract :
Increasing computing power efficiency has become more important as more applications are moving to mobile platforms, which tend to have a limited power available. Being able to perform a wide variety of computations efficiently is especially important for power constrained embedded applications such as unmanned aerial vehicles (UAVs), which may not be able to send the data out for processing and must perform some of the processing on-board. This paper describes a 3D FPGA-DRAM architecture that can not only deliver the necessary flexibility, by using FPGAs, but also provide the computing efficiency in the form of floating-point arithmetic accelerators that is required for UAVs. We examine the efficiency of this system in 65 nm, 90 nm, and 130 nm CMOS technologies and report simulation results showing a peak computing efficiency of 28.94 GFLOPs/W for a 4,096 point 1 dimensional FFT and 25.03 GFLOPs/W for a 1,024 point × 1,024 point 2 dimensional FFT.
Keywords :
CMOS integrated circuits; DRAM chips; field programmable gate arrays; logic design; three-dimensional integrated circuits; 3D FPGA-DRAM architecture; CMOS technologies; FFT; UAV; computing power efficiency; floating-point arithmetic accelerators; power efficient reconfigurable system-in-stack; size 130 nm; size 65 nm; size 90 nm; unmanned aerial vehicles; Benchmark testing; Computer architecture; Field programmable gate arrays; Random access memory; Switches; Three-dimensional displays; Video recording;
Conference_Titel :
System-on-Chip Conference (SOCC), 2014 27th IEEE International
Conference_Location :
Las Vegas, NV
DOI :
10.1109/SOCC.2014.6948892