DocumentCode
1462479
Title
A Model to Study Plastic Deformation in RRP
Wires
Author
Barzi, Emanuela Z. ; Bossert, Marianne ; Gallo, Giuseppe
Author_Institution
Fermi Nat. Accel. Lab. (Fermilab), Batavia, IL, USA
Volume
21
Issue
3
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
2588
Lastpage
2592
Abstract
An important part of superconducting accelerator magnet work is the conductor. To produce magnetic fields larger than 10 T, brittle A15 conductors are typically used. The original round wire, in the form of a composite of Copper (Cu), Niobium (Nb) and Tin (Sn), is assembled into a so-called Rutherford-type cable, which is used to wind the magnet. The magnet is then subjected to a high temperature heat treatment to produce the chemical reactions that make the material superconducting. At this stage the superconductor is brittle and its superconducting properties sensitive to strain. This work is based on the development of a 2D finite element model, which simulates the mechanical behavior of Nb-Sn composite wires under deformation before heat treatment. First the composite was modeled in detail and its behavior analyzed under flat rolling using Finite Element Analysis (FEM). To identify a critical criterion, the strain results of the model were compared with those measured experimentally on cross sections of the deformed composite. Then the model was applied to a number of different wire architectures.
Keywords
brittleness; composite materials; finite element analysis; heat treatment; niobium alloys; plastic deformation; rolling; tin alloys; type II superconductors; wires (electric); 2D finite element model; Nb3Sn; RRP wires; brittle A15 conductors; composite wires; deformed composite; flat rolling; heat treatment; plastic deformation; restacked-rod processed wires; Copper; Data models; Deformable models; Finite element methods; Plastics; Strain; Wires; ${rm Nb}_{3}{rm Sn}$ wires; Finite element model analysis; plastic work; principal strain; restacked-rod process;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2011.2108991
Filename
5722053
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