DocumentCode
1462615
Title
Correlation Between TDDB and VRDB for Low-
Dielectrics With Square Root
Model
Author
Lin, Mingte ; Su, K.C.
Author_Institution
United Microelectron. Corp., Hsinchu, Taiwan
Volume
31
Issue
5
fYear
2010
fDate
5/1/2010 12:00:00 AM
Firstpage
494
Lastpage
496
Abstract
A concise relation between voltage ramp dielectric breakdown (VRDB) and time-dependent dielectric breakdown (TDDB) based on the square-root (SQRT) E model for low- k dielectric-reliability evaluation was established. VRDB and TDDB experiments on low- k dielectrics in Cu interconnects were conducted and showed a very well correlation by this relation. The electric field acceleration parameter of the SQRT E model can be estimated with the dual ramping rate VRDB test. The characteristic of the statistic distribution of VRDB is shown to relate to that of TDDB.
Keywords
copper; integrated circuit interconnections; low-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; statistical distributions; Cu; Cu interconnects; SQRT E model; TDDB experiment; VRDB experiment; dual ramping rate; electric field acceleration parameter; low-k dielectric reliability evaluation; square-root E model; statistic distribution; time-dependent dielectric breakdown; voltage ramp dielectric breakdown; Dielectrics; low-$k$ ; time-dependent dielectric breakdown (TDDB); voltage ramp dielectric breakdown (VRDB);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2010.2044554
Filename
5443502
Link To Document