• DocumentCode
    1462615
  • Title

    Correlation Between TDDB and VRDB for Low- k Dielectrics With Square Root E Model

  • Author

    Lin, Mingte ; Su, K.C.

  • Author_Institution
    United Microelectron. Corp., Hsinchu, Taiwan
  • Volume
    31
  • Issue
    5
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    494
  • Lastpage
    496
  • Abstract
    A concise relation between voltage ramp dielectric breakdown (VRDB) and time-dependent dielectric breakdown (TDDB) based on the square-root (SQRT) E model for low- k dielectric-reliability evaluation was established. VRDB and TDDB experiments on low- k dielectrics in Cu interconnects were conducted and showed a very well correlation by this relation. The electric field acceleration parameter of the SQRT E model can be estimated with the dual ramping rate VRDB test. The characteristic of the statistic distribution of VRDB is shown to relate to that of TDDB.
  • Keywords
    copper; integrated circuit interconnections; low-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; statistical distributions; Cu; Cu interconnects; SQRT E model; TDDB experiment; VRDB experiment; dual ramping rate; electric field acceleration parameter; low-k dielectric reliability evaluation; square-root E model; statistic distribution; time-dependent dielectric breakdown; voltage ramp dielectric breakdown; Dielectrics; low-$k$; time-dependent dielectric breakdown (TDDB); voltage ramp dielectric breakdown (VRDB);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2010.2044554
  • Filename
    5443502