Device and Integration Technology for Silicon Photonic Transmitters

Author

Park, Hyundai ; Sysak, Matthew N. ; Chen, Hui-Wen ; Fang, Alexander W. ; Liang, Di ; Liao, Ling ; Koch, Brian R. ; Bovington, Jock ; Tang, Yongbo ; Wong, Kristi ; Jacob-Mitos, Matt ; Jones, Richard ; Bowers, John E.

Author_Institution

Photonics Technol. Lab., Intel Corp., Santa Clara, CA, USA

Volume

17

Issue

3

fYear

2011

Firstpage

671

Lastpage

688

Abstract

The device and integration technology for silicon photonic transmitters are reviewed in this paper. The hybrid silicon platform enables on-chip lasers to be fabricated with silicon photonic circuits and can be integrated in the CMOS back-end flow. Laser arrays from multiple die bonding and quantum well intermixing techniques are demonstrated to extend the spectral bandwidth from the laser array of the transmitter. Two modulator technologies, silicon modulators and hybrid silicon modulators, are also described.

Keywords

CMOS integrated circuits; elemental semiconductors; integrated optics; microassembling; optical fabrication; optical modulation; optical transmitters; quantum well lasers; semiconductor laser arrays; silicon; CMOS back-end flow; Si; hybrid silicon modulators; integration technology; laser arrays; modulator technologies; multiple die bonding; on-chip lasers; quantum well intermixing techniques; silicon photonic circuits; silicon photonic transmitters; spectral bandwidth; Gratings; Lasers; Measurement by laser beam; Optical waveguides; Photonics; Silicon; Waveguide lasers; Optoelectronic devices; photonic integration; semiconductor lasers; silicon photonics;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2011.2106112

Filename

5722968