Abstract :
New developments in component materials and techniques are discussed under the following headings: capacitors (ceramic disc, barrier layer and tantalum electrolytic); piezoelectric devices (filters); inductive devices (core, parametric and transformer techniques); semi-conductors (tunnel diode, variable capacitance diode, silicon controlled rectifier, thermo-electric components, solar cell, Hall effect); information storage systems (square loop ferrites); microminiature devices (component substrate, vacuum deposition, solid circuits). Transistors and thermionic tubes are not considered.
