• DocumentCode
    146321
  • Title

    A new approach using symbolic analysis to compute path-dependent effective properties preserving hierarchy

  • Author

    SRINIVASAN, SUDARSHAN ; Cohen, Emmanuel ; Hofmann, Martin

  • Author_Institution
    Mentor Graphics Corp, Wilsonville, OR, USA
  • fYear
    2014
  • fDate
    2-5 Sept. 2014
  • Firstpage
    404
  • Lastpage
    408
  • Abstract
    This paper describes a technique to calculate an effective property of intentional devices, like resistors, preserving design hierarchy. Traditional methods of computing effective properties like point-to-point resistance, involved using a flat netlist and solving a conductance matrix or flattening a hierarchical netlist and applying reduction techniques to reduce parallel and series resistors. These traditional techniques are not conducive to computing effective resistances on partial paths in hierarchical designs and then using those values to do other rule checks. This is because flattening a netlist of millions of devices to compute a partial path property is very expensive in memory. This paper focuses on an algorithm to efficiently compute effective path-dependent properties on intentional devices in a netlist.
  • Keywords
    electrostatic discharge; industrial property; system-on-chip; DRC; ERC; clamping resistance; design rule checks; electrical rule checks; electrostatic discharge; hierarchical designs; hierarchical netlist; intellectual property; path-dependent effective properties preserving hierarchy; point-to-point resistance; symbolic analysis; system-on-chip; Algorithm design and analysis; Electrostatic discharges; Logic gates; Performance evaluation; Resistance; Resistors; System-on-chip; Design Rule Checks (DRC); Electrical Overstress (EOS); Electrical Rule Checks (ERC); Electronic Design Automation (EDA); Electrostatic Discharge (ESD); Hard IP (HIP); Intellectual Property(IP); Layout-vs-Schematic (LVS); System-On-Chip (SOC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System-on-Chip Conference (SOCC), 2014 27th IEEE International
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/SOCC.2014.6948963
  • Filename
    6948963