Title :
Analysis of a partially sealed package for microstrip-line circuits
Author :
Chen, Hao-Hui ; Chung, Shyh-Jong
Author_Institution :
Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fDate :
12/1/1998 12:00:00 AM
Abstract :
A partially sealed package formed by two metal diaphragms with or without an absorber is proposed and analyzed for shielded microstrip-line circuits. The mode-matching method, method of lines, and finite-element method are mixed appropriately to investigate the package. For a specific analysis, an electric current filament and a microstrip-line gap are chosen to simulate, respectively, an active circuit element (CE) and a passive CE to be packaged. The suppression effect of the package on the spurious (higher order) modes and the influence on the dominant mode are fully studied by comparing the excitation and scattering characteristics of the CE´s with and without the package
Keywords :
diaphragms; finite element analysis; method of lines; microstrip circuits; microwave circuits; millimetre wave circuits; mode matching; packaging; FEM; absorber; active circuit element; dominant mode; electric current filament; excitation characteristics; finite-element method; higher order modes; metal diaphragms; method of lines; microstrip-line gap; mode-matching method; partially sealed package; passive circuit elements; scattering characteristics; shielded microstrip-line circuits; spurious modes; suppression effect; Distributed parameter circuits; Electromagnetic interference; Electromagnetic scattering; Electromagnetic waveguides; Frequency; Microstrip components; Packaging; Power transmission lines; Resonance; Transmission line discontinuities;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
