Title :
Laser weldability analysis of high-speed optical transmission device packaging
Author :
Song, Min Kyu ; Kang, Seung GOO ; Hwang, Nam ; Lee, Hee Tae ; Park, Seong Su ; Pyun, Kwang Eui
Author_Institution :
Semicond. Packaging Sect., Electron. & Telecommun. Res. Inst., Taejon, South Korea
fDate :
11/1/1996 12:00:00 AM
Abstract :
A 2.5 Gb/s distributed feedback laser diode (DFB-LD) module was used as a test package to develop laser welding techniques. Various package weld joint geometries, such as lap, fillet, butt, and fillet-lap, were designed and welded to investigate the optimal package configuration that leads to the maximum coupling efficiency and minimum weld shift. Furthermore, the welded joints at a given set of laser parameters were cross-sectioned for metallurgical analysis, such as weld penetration and microcracks, for verification of the weld joint integrity. Through such analysis, some important laser welding parameters, such as depth-of-penetration (DOP), heat-affected zone (HAZ), shear-strength, and solidification formation of the weld pool were analyzed. Also, as the result of investigating 56 laser welded DFB-LD submodules, optimal laser parameters, and the suitable joint geometry for this package could be determined with the average weld shift less than 0.19 dB, which translates to less than 1.0 μm in radial displacement. These laser welded packages exhibited an excellent tracking stability during environmental testing, which consequently resulted in obtaining a desirable bit-error rate (BER) during the data transmission performance analysis
Keywords :
distributed feedback lasers; high-speed optical techniques; laser beam welding; optical communication equipment; optical fabrication; semiconductor device packaging; semiconductor lasers; 2.5 Gbit/s; bit-error rate; coupling efficiency; data transmission; depth of penetration; distributed feedback laser diode module; environmental testing; heat affected zone; high-speed optical transmission device packaging; joint geometry; laser welding; metallurgical analysis; shear strength; solidification; tracking stability; weld shift; Bit error rate; Distributed feedback devices; Geometrical optics; High speed optical techniques; Laser feedback; Laser stability; Optical feedback; Packaging; Testing; Welding;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on