Title :
Micro thermal management of high-power diode laser bars
Author :
Lorenzen, Dirk ; Bonhaus, Jörg ; Fahrner, Wolfgang R. ; Kaulfersch, Eberhard ; Wörner, Eckhard ; Koidl, Peter ; Unger, Katrin ; Müller, Dietmar ; Rölke, Stefan ; Schmidt, Herbert ; Grellmann, Michael
Author_Institution :
Jenoptik Laserdiode GmbH, Jena, Germany
fDate :
4/1/2001 12:00:00 AM
Abstract :
Lifetime and reliability of high-power diode laser bars are sensitively related to operating temperature, mounting stress, and solder electromigration. These three factors have been taken into account for the development of a new packaging technology for 1 cm laser bars of gallium arsenide. We examine the use of chemical-vapor-deposited (CVD) diamond as heatspreaders in order to reduce thermal resistance of a microchannel cooler for liquid cooling. We show that it is possible to perform hard soldering on a CVD-diamond with a new technique. Additionally, we present a controlled water cooling system fit to the flow characteristics of the cooler. It permits one to adjust the emission wavelength of the diode lasers by changing the water flux
Keywords :
CVD coatings; III-V semiconductors; brazing; diamond; gallium arsenide; laser reliability; semiconductor lasers; temperature control; thermal management (packaging); thermal resistance; CVD diamond; GaAs; chemical-vapor-deposited diamond; controlled water cooling system; emission wavelength adjustment; gallium arsenide; hard soldering; heatspreaders; high-power diode laser bars; lifetime; liquid cooling; micro thermal management; microchannel cooler; mounting stress; operating temperature; packaging; packaging technology; reliability; solder electromigration; temperature control; thermal resistance reduction; thermoelasticity; water flux; Bars; Chemical lasers; Chemical technology; Diode lasers; Electromigration; Packaging; Temperature sensors; Thermal management; Thermal resistance; Thermal stresses;
Journal_Title :
Industrial Electronics, IEEE Transactions on