DocumentCode
1464088
Title
VLSI interconnect design automation using quantitative and symbolic techniques
Author
Simunic, Tajana ; Rozenblit, Jerzy W. ; Brews, John R.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume
19
Issue
4
fYear
1996
fDate
11/1/1996 12:00:00 AM
Firstpage
803
Lastpage
812
Abstract
This paper presents a framework for design automation of VLSI interconnect geometries. Crosstalk, overshoot, undershoot, signal delay, and line impedance are design performance parameters under consideration. Since the dependence of electrical performance parameters on geometry is not easily defined, both qualitative and quantitative techniques are used. Two knowledge bases are introduced-a model and simulation base. The model base contains models used for terminations, transmission line parameter extractors, and transmission lines. The simulation knowledge base contains a set of approximations and routines for the exact evaluation of electrical performance parameters. Procedures are introduced for the automatic extraction of applicable models and simulation techniques in the design process. An unconstrained optimization routine is used as a design search technique. The approach presented here gives faster results than approaches shown in literature, with little sacrifice of accuracy
Keywords
VLSI; circuit CAD; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; VLSI interconnect; crosstalk; design automation; electrical performance; knowledge base; line impedance; model; optimization; overshoot; parameter extraction; quantitative technique; search technique; signal delay; simulation; symbolic technique; termination; transmission line; undershoot; Crosstalk; Delay lines; Design automation; Design optimization; Geometry; Impedance; Process design; Signal design; Transmission lines; Very large scale integration;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.544372
Filename
544372
Link To Document