Title :
Analysis of shielded lossy multilayered-substrate microstrip discontinuities
Author :
Tony, Essam S. ; Chaudhuri, Sujeet K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
fDate :
4/1/2001 12:00:00 AM
Abstract :
The spatial Green´s function for a rectangular cavity partially filled with multiple layers of lossy dielectrics has been derived. The Green´s function is used to compute the fields around a discontinuity in a transmission line. To analyze a discontinuity, the unknown surface current maintained on the microstrip discontinuity is expanded in terms of known suitable basis functions. The electric-field components in the plane of the discontinuity region are then written in terms of this current. Imposing the boundary condition that the component of the electric-field tangential to the metallization is zero yields the electric-field integral equation (EFIE). The method of moments is applied to the EFIE to obtain a system of linear equations. The resultant semianalytical expressions were used to conduct accurate modeling of a variety of structures. The validity and accuracy of this method are established through comparison with other published results. Convergence considerations are outlined and verified
Keywords :
S-matrix theory; convergence of numerical methods; electric field integral equations; impedance matrix; method of moments; microstrip discontinuities; waveguide theory; EFIE; basis functions; boundary condition; convergence; electric-field components; electric-field integral equation; impedance matrix; lossy dielectrics; method of moments; multilayered-substrate microstrip discontinuities; rectangular cavity; scattering matrix; shielded lossy microstrip discontinuities; spatial Green function; surface current; transmission line; Boundary conditions; Convergence; Dielectric losses; Green´s function methods; Integral equations; Metallization; Microstrip; Moment methods; Transmission line discontinuities; Transmission lines;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on