DocumentCode :
1464367
Title :
InAlN/GaN HEMTs With AlGaN Back Barriers
Author :
Lee, Dong Seup ; Gao, Xiang ; Guo, Shiping ; Palacios, Tomás
Author_Institution :
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume :
32
Issue :
5
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
617
Lastpage :
619
Abstract :
This letter studies the effect of AlGaN back barriers in the dc and RF performance of In0.17Al0.83N/GaN high-electron mobility transistors grown on SiC substrates. When compared to conventional structures without a back barrier, the back barrier effectively prevents the degradation of drain-induced barrier lowering and significantly improves the output resistance in sub-100-nm-gate-length devices. The reduction in short-channel effects helps to increase the frequency performance of AlGaN back-barrier devices. For a 65-nm gate length, the current gain cutoff frequency (fT) of a transistor with an AlGaN back barrier is 210 GHz, which is higher than that of the standard device with the same gate length (fT = 195 GHz).
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; millimetre wave field effect transistors; wide band gap semiconductors; AlGaN back barriers; HEMT; In0.17Al0.83N-GaN; SiC; drain-induced barrier; frequency 210 GHz; gate length; gate-length devices; high-electron mobility transistors; short-channel effect reductoin; size 65 nm; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Performance evaluation; Radio frequency; AlGaN back barrier; GaN; InAlN; current gain cutoff frequency $(f_{T})$; drain-induced barrier lowering (DIBL); high-electron-mobility transistor (HEMT); output resistance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2111352
Filename :
5723687
Link To Document :
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