Title :
High performance Si/Si/sub 1-x/Gex resonant tunneling diodes
Author :
See, P. ; Paul, D.J. ; Holländer, B. ; Mantl, S. ; Zozoulenko, I.V. ; Berggren, K.F.
Author_Institution :
Cavendish Lab., Cambridge Univ., UK
fDate :
4/1/2001 12:00:00 AM
Abstract :
Resonant tunneling diodes (RTDs) with strained i-Si/sub 0.4/Ge/sub 0.6/ potential barriers and a strained i-Si quantum well, all on a relaxed Si/sub 0.8/Ge/sub 0.2/ virtual substrate were successfully grown by ultra high vacuum compatible chemical vapor deposition and fabricated using standard Si processing methods. A large peak to valley current ratio of 2.9 and a peak current density of 4.3 kA/cm/sup 2/ at room temperature were recorded from pulsed and continuous dc current-voltage measurements, the highest reported values to date for Si/Si/sub 1-x/Ge/sub x/ RTDs. These dc figures of merit and material system render such structures suitable and highly compatible with present high speed and low power Si/Si/sub 1-x/Ge/sub x/ heterojunction field effect transistor based integrated circuits.
Keywords :
Ge-Si alloys; chemical vapour deposition; current density; field effect integrated circuits; internal stresses; quantum well devices; resonant tunnelling diodes; semiconductor device measurement; silicon; RTDs; Si processing; Si/Si/sub 1-x/Ge/sub x/ HFET based integrated circuits; Si/sub 0.4/Ge/sub 0.6/-Si; Si/sub 0.8/Ge/sub 0.2/; band gap engineered device; continuous dc current-voltage measurements; dc figures of merit; high performance Si/Si/sub 1-x/Ge/sub x/ resonant tunneling diodes; peak current density; peak to valley current ratio; pulsed dc current-voltage measurements; relaxed Si/sub 0.8/Ge/sub 0.2/ virtual substrate; strained i-Si quantum well; strained i-Si/sub 0.4/Ge/sub 0.6/ potential barriers; ultra high vacuum compatible chemical vapor deposition; Chemical vapor deposition; Current density; Current measurement; Density measurement; Diodes; Elementary particle vacuum; Heterojunctions; Pulse measurements; Resonant tunneling devices; Temperature;
Journal_Title :
Electron Device Letters, IEEE