DocumentCode
1464699
Title
Simulation of a high performance MOSFET with a quantum wire structure incorporating a periodically bent Si-SiO2 interface
Author
Tanaka, Junko ; Sawada, Akemi
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Volume
43
Issue
12
fYear
1996
fDate
12/1/1996 12:00:00 AM
Firstpage
2185
Lastpage
2189
Abstract
A MOSFET using a serrated quantum wire structure that produces one-dimensional electron confinement shows excellent subthreshold characteristics and enhanced drive capability compared to a conventional MOSFET with a flat Si-SiO2 interface. We studied the quantum wire structure with its periodically bent Si-SiO2 interface using simulations. The potential in the convex regions of the silicon is 0.34 V higher than that in the concave ones when the bending angle is 90°, the bending period is 100 nm, substrate doping is 3.0×10 17 cm-3, and a gate voltage is 0.1 V. Because of this increase in potential in the convex regions, electrons are confined in a narrow width of 13 nm in the convex regions. This 1-D electron confinement effect by the bent Si-SiO2 interface is clearly observed at low gate voltage and is reduced as the gate voltage becomes higher. Due to the confinement effect, drain current in the MOSFET with this quantum wire structure is 270 times higher than that of a MOSFET with a flat Si-SiO2 interface at a gate voltage of 0.05 V. In addition, the short-channel effect is more effectively suppressed in this MOSFET than in a conventional MOSFET
Keywords
MOSFET; semiconductor device models; semiconductor quantum wells; semiconductor quantum wires; MOSFET; Si-SiO2; drain current; drive capability; one-dimensional electron confinement; periodically bent Si-SiO2 interface; serrated quantum wire; short-channel effect; simulation; subthreshold characteristics; Doping; Electron mobility; Electrons; Gallium arsenide; Heterojunctions; Low voltage; MOSFET circuits; Quantum mechanics; Silicon; Substrates; Wire;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.544390
Filename
544390
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